There are many steps in semiconductor fabrication, requiring highly specialized tools for each process. From initial writing of sub-micron and nanometric patterns onto masks, reticles, or wafers…to high precision cross-sectional samples of processed wafers and imaging these microscopic slices…to rapid analysis of particles and defects on the wafer surface or edge.
JEOL offers several tools to aid research and manage yield. We produce e-beam lithography systems and FE-SEMs used to write high precision masks, reticles, and wafers. FIB/SEM solutions for high throughput, cross-section imaging and defect review tools designed for rapid inspection.
JEOL offers leading-edge solutions for 200/300mm, nano-fabrication processes and research -- backed by award-winning 24/7 service support and long-term commitment to our customers.
JEOL has served the semiconductor industry for more than 50 years with both e-beam and ion beam optics designed for precise patterning and inspection. Our latest generation of tools offers advanced capabilities that will take you through several next-generation designs – through the 22nm node.
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UHR Field Emission SEM
Ultrahigh resolution FE SEM with the most advanced high-resolution analytical technology available today.
Field Emission SEM
High resolution, large chamber FE SEM. Compact, versatile Field Emission SEM that offers Smart-Flexible-Powerful performance at a great value.
InTouchScope™ SEM
Versatile research grade SEM.
Benchtop SEM
Incorporates advanced technology and functions that make it simple for users at any skill level to obtain outstanding SEM images and elemental analysis results in minutes.
200kV TEM
Automated, high-throughput S/TEM designed to meet the unique demands of semiconductor device development and manufacturing.
300kV TEM
World's highest resolution in a commercially-available TEM - 300kV.
200kV TEM
Atomic resolution TEM with (Cold-FEG) and next-generation Cs corrector (ASCOR).
200kV TEM
Ultrahigh energy resolution EELS analysis of materials at the atomic scale.
200kV TEM
Advanced analytical, high throughput 200kV S/TEM with Cold Field Emission Gun and dual Silicon Drift Detectors.
200kV TEM
A revolutionary magnetic field-free atomic resolution imaging system.
FIB-SEM
A multipurpose FIB-SEM that delivers the synergy of fast sample preparation, SEM imaging and EDS analysis in a single instrument.
E-Beam Lithography
Direct Write Systems.
E-Beam Lithography
High Throughput Direct Write System.
E-Beam Lithography
Mask/Reticle Fabrication.
Field Emission EPMA
Ultrahigh imaging and analytical resolution with a very high and stable probe current for optimum analytical performance.
LaB6 EPMA
Research grade microprobe.
Field Emission Auger
Field Emission Auger Microprobe, offers the highest spatial resolution available in an Auger microprobe.
Sample Prep
Easy-to-use, sample preparation device for SEM, EPMA, and SAM applications. Broad ion beam polishing using the JEOL cross-section polisher (CP) offers pristine surface preparation with minimal artifacts.
FIB-SEM
Automatic TEM Specimen Preparation System STEMPLING is software for automatic TEM specimen preparation by using FIB.
TEM
3D reconstruction and 3D visualization software applications.